Semiconductor Manufacturing and Packaging
Get the full GTU study material, English & Gujarati textbook PDFs, syllabus curriculum, and solved previous year question papers.
English Book & Chapters
English Book Coming Soon
We are working hard to add this material. Stay tuned for updates!
Follow on Instagram for UpdatesGTU Previous Year Papers
Papers Coming Soon
We are working hard to add this material. Stay tuned for updates!
Follow on Instagram for UpdatesSemiconductor Manufacturing and Packaging Syllabus — Unit-wise Content
The official GTU curriculum for Semiconductor Manufacturing and Packaging (subject code ME02096071) as prescribed for EACD · Semester 2 divides the course into 7 units, covering 33 listed topics. The unit-wise breakdown below is read from the GTU syllabus document for this subject code, so you can check what the course actually covers before deciding which papers to attempt.
Download the official syllabus PDF (ME02096071)Unit 1 Package form factors and families
- package outline standardization
- leaded package families
- quad lead package families
- substrate-based package families
- chip scale packages
- staked-die package family
- package-on-package and related variations
- flip-chip packages
- wafer- level chip scale packages
Unit 2 Surface-Mount Technology
- package cracking or ‘popcorning’
- surface-mount packages
- issues with advanced packaging
- current and future trends
Unit 3 Materials used in semiconductor packaging
- Polymers: molding compounds
- die attach adhesives
- underfill materials
- organics substrates
Unit 4 Metals
- lead frames
- heat spreaders, and heat sinks
- bonding wires
- wafer bumping
- technical issues. 6 15
Unit 5 Ceramics and Glasses
- types of ceramics used in semiconductor packaging
- types of glasses used in semiconductor packaging
Unit 6 Reliability Testing
- examples of reliability tests: preconditioning conditions
- temperature cycling and thermal shock
- high-temperature storage life
- temperature-humidity-bias tests
- limitation of reliability testing
Unit 7 Trends and Challenges
- copper interconnects and low-k dielectric materials
- dielectric constant requirements at each technology node
- future interconnect and dielectric materials
- future packaging options
Study on Android App:
