Fundamental of Semiconductor Package Manufacturing and Test
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Fundamental of Semiconductor Package Manufacturing and Test Syllabus — Unit-wise Content
The official GTU curriculum for Fundamental of Semiconductor Package Manufacturing and Test (subject code 3160004) as prescribed for Food Engg. · Semester 6 divides the course into 5 units, covering 45 listed topics. The unit-wise breakdown below is read from the GTU syllabus document for this subject code, so you can check what the course actually covers before deciding which papers to attempt.
Download the official syllabus PDF (3160004)Unit 1 PACKAGE MANUFACTURING PROCESSES
- Packaging Assembly Technology
- Wafer Thinning
- Die Attach
- Wire bonding
- Flip Chip process
- Flux Cleaning
- Laser Marking
- Solder Ball Attach
- IC Packaging Toolsets & equipment operation
- clean room operations
Unit 2 SEMICONDUCTOR COMPONENT AND PACKAGE TEST
- Overview of Testing methodologies
- components tested & their characteristics
- Challenges in testing
- Types of Testers (Automated test equipment & Benchtop Testers)
- Components & Subsystems of Testers
- Principles of Functional Testing
- Parametric/ Boundary Scan /In-Circuit Test/ Flying Probe Test
- Test Data Analysis
- Design for Testability & Tester Calibration & Maintenance
- Future Trends
Unit 3 SEMICONDUCTOR PACKAGE MATERIALS AND
- QUALIFICATION Reliability testing & qualification- MST/MSL
- HAST & uHAST
- Mold Compounds (Moldability)
- Underfill Materials
- Die Attach Adhesives & Films
- Substrate Technology
- Bonding Wire
- Solder & Dielectric materials
Unit 4 ELECTRICAL AND PHYSICAL FAILURE ANALYSIS
- Package failure modes
- Failure detection mechanisms
- Failure analysis tools
- Test programs debugging
- Data Analytics
- ESD & EMI Management
Unit 5 INDUSTRIAL QUALITY AND STATISTICAL PROCESS
- CONTROL Quality Control Plan (QCP) & Quality Management System (QMS)
- Incoming Material Inspection
- In-Line Quality
- Measurement System Analysis
- Statistical analysis methods
- Statistical Process Control (SPC)
- Fault Detection Control (FDC)
- Run-to-Run Control (R2R)
- Auto Defect Classification (ADC)
- Data Analytics
- Machine Communication Protocol and System Integration
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