Unit 1 Unit – I

2 lecture hours

• Overview of the Electromagnetic Theory: Maxwells’ equation
• fields in media and boundary conditions
• the wave equations
• the basic plane wave solutions
• boundary conditions
• general plane wave solutions
• reflection coefficients
• standing wave
• return loss
• characteristics impedance
• wave impedance
• intrinsic impedance
• smith charts and its applications
• transmission lines and waveguides
• microstrip lines
• strip lines

Unit 2 Unit – II

3 lecture hours

• Microwave Network Analysis: Impedance and equivalent voltages and currents
• Impedance and admittance matrices
• the scattering matrix
• the transmission matrix
• signal flow graphs

Unit 3 Unit – III

4 lecture hours

• Impedance matching: matching with lumped elements
• Single-stub tuning
• Double stub tuning
• the quarter wave transformer
• the theory of small refelections
• binomial multisection matching transformers
• Chebyshev multisection matching transformers

Unit 4 Unit-IV

• Microwave Resonators: Series and parallel resonant circuits
• transmission line resonators
• rectangular waveguide cavity resonators

Unit 5 Unit-V

8 lecture hours

• Power Diviser and Directional Couplers: Basic properties of dividers and couplers
• the T-junction power divider
• The Wilkinson power divider
• waveguide directional coupler
• the quadrature hybrid
• the Lange coupler
• the 180° hybrid

Unit 6 Unit-VI

8 lecture hours

• Microwave Filters: Periodic structures
• filter design by the image parameters method, and the insertion loss method
• filter transformation
• Filter implementation

Unit 7 Unit-VII

• Active RF and Microwave Devices: Diodes and diode circuits, BJT, FET, Microwave Integrated Circuits
• Microwave Tubes

Unit 8 Unit – VIII

4 lecture hours

• Hybrid MICs: Definition
• comparison with conventional circuits
• fields of application and limitations and criteria for the choice of substrate material
• thin-film hybrid circuits
• thick-film hybrid circuits
• mask making
• resistor stabilization
• brazing process
• wire bonding

Unit 9 Unit- IX

4 lecture hours

• Monolithic MICs: Definition
• substrate structure
• doping by ion implantation ohmic contact
• metal resistive layers
• gate metal
• dielectric second level metal
• dielectric and air bridge vias
• substrate vias
• final wafer process steps