Semiconductor Technology
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Follow on Instagram for UpdatesSemiconductor Technology Syllabus — Unit-wise Content
The official GTU curriculum for Semiconductor Technology (subject code ME01000291) as prescribed for E(E& · Semester 1 divides the course into 6 units, covering 51 listed topics. The unit-wise breakdown below is read from the GTU syllabus document for this subject code, so you can check what the course actually covers before deciding which papers to attempt.
Download the official syllabus PDF (ME01000291)Unit 1 Introduction
- Overview of VLSI design methodology
- VLSI design flow
- Design hierarchy
- Concept of Regularity
- Modularity, and Locality
- VLSI design style
- Design quality
- package technology
- Introduction to FPGA and CPLD
- Computer Aided design technology, PLA, PAL, SPLD
- SoC Technology
Unit 2 MOS Transistor and its Fabrication
- The Metal Oxide Semiconductor (MOS) structure
- Structure and Operation of MOS transistor
- MOSFET scaling
- MOSFET capacitances Fabrication of MOSFET: Introduction
- Basic steps
- C-MOS n-Well Process
- Layout Design rules
- full custom mask layout design
Unit 3 Crystal Growth, Wafer Preparation, Epitaxy and Oxidation
- Electronic Grade Silicon
- Czochralski crystal growing
- Silicon Shaping
- processing considerations and future trends
- Vapor phase Epitaxy
- Epitaxial Evaluation and future trends
- Growth Mechanism and kinetics
- Thin Oxides
- Oxidation Techniques and Systems
- Oxidation of Poly Silicon
Unit 4 Lithography and Relative Plasma Etching
- Optical Lithography
- Electron Lithography
- Feature Size control& Anisotropic Etch mechanism
- Reactive Plasma Etching techniques and Equipment
Unit 5 Deposition, Diffusion, Ion Implementation and Metallization
- Deposition process
- Poly silicon
- plasma assisted Deposition
- Atomic Diffusion Mechanism
- Implant equipment
- Annealing Shallow junctions
- High-energy implantation
- Physical vapor deposition
- Patterning and future trends
Unit 6 Concept of VLSI Process Integration and Fin-FET Device
- Ion implantation
- Diffusion and oxidation
- Etching and Deposition
- NMOS IC Technology
- CMOS IC Technology
- MOS Memory IC technology
- FinFET Device: Introduction
- need of FinFET device
- Comparison between FinFET and Planar MOSFET
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