Introduction to MEMS
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Introduction to MEMS Syllabus — Unit-wise Content
The official GTU curriculum for Introduction to MEMS (subject code 3171107) as prescribed for Electronics · Semester 7 divides the course into 6 units, covering 38 listed topics. The unit-wise breakdown below is read from the GTU syllabus document for this subject code, so you can check what the course actually covers before deciding which papers to attempt.
Download the official syllabus PDF (3171107)Unit 1 Introduction
- Transducers, and actuators
Unit 2 Materials and Fabrication Techniques
- Additive Materials
- Fabrication Techniques
- Lithography Etching
- Surface Micromachining
- Wafer Bonding
- Thick-Film Screen Printing
- Electroplating LIGA
- Porous Silicon
- Electrochemical Etch Stop
- Focused Ion Beam Etching and Deposition
Unit 3 MEMS Simulation and Design Tools
- Simulation and Design Tools
- Behavioral Modeling Simulation Tools
- Static Analysis
- Linearized Analysis, and Transient Analysis of MEMS devices
Unit 4 Mechanical Sensor Packaging
- Standard IC Packages
- Ceramic Packages
- Plastic Packages
- Metal Packages
- Packaging Processes
- Electrical Interconnects
- Methods of Die Attachment
- Sealing Techniques MEMS Mechanical Sensor Packaging
- Protection of the Sensor from Environmental Effects Protecting the Environment from the Sensor
- Mechanical Isolation of Sensor Chips
Unit 5 Mechanical Transduction Techniques
- Capacitive Techniques
- Optical Techniques
- Phase Wavelength
- Spatial Position
- Resonant Techniques
- Vibration Excitation and Detection Mechanisms
- Resonator Design Characteristics
- Actuation Techniques
- Electrostatic Piezoelectric
- Smart Sensors
Unit 6 MEMS applications
- MEMS as Secondary Storage in Computer System
- Optical Applications
- Biomedical Application 2 Subject Code: 3171107 w.e.f
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